MEMS Packaging Services

In addition to ceramic and metallic packages specially designed for uncooled bolometric detectors and high-end military and space applications, we can put together a custom package to your specifications. INO specializes in three main packaging technologies:

• Pinching of pump-out tube with thermoelectric cooler (TEC)
• Solder sealing (1-step)
• Solder sealing (2-step) with TEC

Packaging operations are performed using state-of-the-art vacuum furnaces and systems that allow for the activation of various types of getters. Depending on the technology used, vacuum levels can now be maintained at < 10 mTorr for up to 25 years. 

We offer a full range of services for all your MEMS needs:

• MEMS and microbolometer design
• MEMS foundry services
• Gold black deposition services
• Optical thin film design and deposition services
• Hermetic vacuum packaging