Solder layers consist of a stack of gold, nickel, and chrome films deposited onto specific areas around a window. This stack of metals makes it possible to hermetically solder the window to its package to maintain the functional integrity of the FPA, the detector, or the sensor.
We offer hermetic solder layer deposition services for hermetic packaging. Our highly flexible process allows us to meet your specific requirements. We can deposit metallic thin films of gold, nickel, chrome, or titanium on various materials such as glass, ceramic, silicon, germanium, sapphire, quartz, diamond, and metals. Samples can be supplied individually or in chip wafers up to 200 mm in diameter, which can then be cut to the desired dimensions.
We offer customized metallization capabilities for package lids and windows for vacuum seal packaging:
Nominal specifications of solderable layer deposition: